Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176321 | Semiconductor packages and method of forming the same | Hung-Jui Kuo, Hui-Jung Tsai, Yu-Tzu Chang | 2024-12-24 |
| 12148732 | Package structure and method of fabrcating the same | Hung-Jui Kuo, Hui-Jung Tsai, Yu-Tzu Chang | 2024-11-19 |
| 12132023 | Integrated circuit, package structure, and manufacturing method of package structure | Hung-Jui Kuo, Hui-Jung Tsai, Tai-Min Chang | 2024-10-29 |
| 12071456 | Extended recombinant polypeptides and compositions comprising same | Volker Schellenberger, Joshua Silverman, Benjamin Spink, Willem P. Stemmer, Nathan Geething +2 more | 2024-08-27 |
| 11990383 | Package structure having at least one die with a plurality of taper-shaped die connectors | Hung-Jui Kuo, Hui-Jung Tsai, Tai-Min Chang | 2024-05-21 |
| 11981744 | Chimeric polypeptide assembly and methods of making and using the same | Volker Schellenberger, Fan Yang, Desiree THAYER, Bee-Cheng Sim | 2024-05-14 |