Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12164232 | Method for removing resistor layer, and method of manufacturing semiconductor | Hung-Jui Kuo, Hui-Jung Tsai | 2024-12-10 |
| 12132023 | Integrated circuit, package structure, and manufacturing method of package structure | Hung-Jui Kuo, Hui-Jung Tsai, Chia-Wei Wang | 2024-10-29 |
| 11990383 | Package structure having at least one die with a plurality of taper-shaped die connectors | Hung-Jui Kuo, Hui-Jung Tsai, Chia-Wei Wang | 2024-05-21 |