Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12062603 | Semiconductor device having via sidewall adhesion with encapsulant | Chen-Hua Yu, Hui-Jung Tsai, Hung-Jui Kuo | 2024-08-13 |
| 12020983 | Processes for reducing leakage and improving adhesion | Hui-Jung Tsai, Hung-Jui Kuo, Chen-Hua Yu | 2024-06-25 |