Issued Patents 2024
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176282 | Manufacturing method of semiconductor package | Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh +7 more | 2024-12-24 |
| 12166015 | Semiconductor package and manufacturing method of semiconductor package | Wei-Kang Hsieh, Hao-Yi Tsai, Kuo Lung Pan, Ting Hao Kuo, Yu-Chia Lai +3 more | 2024-12-10 |
| 12164158 | Package having prism structure and manufacturing method thereof | Che-Hsiang Hsu, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh +3 more | 2024-12-10 |
| 12105323 | Semiconductor package | Chung-Ming Weng, Hua-Kuei Lin, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai +5 more | 2024-10-01 |
| 12078845 | Optical system | Feng-Wei Kuo, Chewn-Pu Jou, Cheng-Tse Tang | 2024-09-03 |
| 12040283 | Method of fabricating semiconductor structure | Tzu-Sung Huang, Cheng-Chieh Hsieh, Hsiu-Jen Lin, Hui-Jung Tsai, Hao-Yi Tsai +4 more | 2024-07-16 |
| 12038599 | Photonic package and method of manufacture | Chen-Hua Yu, Hsing-Kuo Hsia, Kuo-Chiang Ting, Jiun Yi Wu, Shang-Yun Hou | 2024-07-16 |
| 12014979 | Methods of forming semiconductor packages | Kuo Lung Pan, Shu-Rong Chun, Teng-Yuan Lo, Chih-Horng Chang, Tin-Hao Kuo +1 more | 2024-06-18 |
| 12002799 | Die stacking structure and method forming same | Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Tsung-Yuan Yu +1 more | 2024-06-04 |
| 11996227 | Hexagonal semiconductor package structure | Tzu-Sung Huang, Chen-Hua Yu, Hao-Yi Tsai, Ming Hung Tseng | 2024-05-28 |
| 11953740 | Package structure | Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh +3 more | 2024-04-09 |
| 11947173 | Photonic semiconductor device and method of manufacture | Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh +3 more | 2024-04-02 |