Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12014976 | Chip package structure including a silicon substrate interposer and methods for forming the same | Kuo Lung Pan, Yu-Chia Lai, Mao-Yen Chang, Po-Yuan Teng, Chen-Hua Yu +3 more | 2024-06-18 |
| 12014979 | Methods of forming semiconductor packages | Kuo Lung Pan, Shu-Rong Chun, Hung-Yi Kuo, Chih-Horng Chang, Tin-Hao Kuo +1 more | 2024-06-18 |
| 11984372 | Integrated circuit package and method | Lipu Kris Chuang, Hsin-Yu Pan | 2024-05-14 |