Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12166015 | Semiconductor package and manufacturing method of semiconductor package | Wei-Kang Hsieh, Hung-Yi Kuo, Hao-Yi Tsai, Kuo Lung Pan, Ting Hao Kuo +3 more | 2024-12-10 |
| 12107064 | Semiconductor package and manufacturing method thereof | Jen-Jui Yu, Chih-Chiang Tsao, Hsuan-Ting Kuo, Hsiu-Jen Lin, Ching-Hua Hsieh +1 more | 2024-10-01 |
| 12014976 | Chip package structure including a silicon substrate interposer and methods for forming the same | Kuo Lung Pan, Yu-Chia Lai, Teng-Yuan Lo, Po-Yuan Teng, Chen-Hua Yu +3 more | 2024-06-18 |
| 11942451 | Semiconductor structure and method of forming the same | Yu-Chia Lai, Cheng-Shiuan Wong, Ting Hao Kuo, Ching-Hua Hsieh, Hao-Yi Tsai +2 more | 2024-03-26 |