Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12107064 | Semiconductor package and manufacturing method thereof | Chih-Chiang Tsao, Hsuan-Ting Kuo, Mao-Yen Chang, Hsiu-Jen Lin, Ching-Hua Hsieh +1 more | 2024-10-01 |
| 12051639 | Package structure and manufacturing method thereof | Chih-Chiang Tsao, Chao-Wei Chiu, Hsiu-Jen Lin, Ching-Hua Hsieh | 2024-07-30 |
| 12051655 | Package structure and method of forming the same | Ching-Hua Hsieh, Cheng-Ting Chen, Hsiu-Jen Lin, Wei-Yu Chen, Chih-Chiang Tsao +1 more | 2024-07-30 |
| 11862577 | Package structure and method of fabricating the same | Hao-Jan Pei, Ching-Hua Hsieh, Hsiu-Jen Lin, Wei-Yu Chen, Chia-Shen Cheng +2 more | 2024-01-02 |