Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12144065 | Warpage control in the packaging of integrated circuits | Ming-Da Cheng, Hsiu-Jen Lin, Wei-Yu Chen, Chien-Wei Lee, Chung-Shi Liu | 2024-11-12 |
| 12051655 | Package structure and method of forming the same | Jen-Jui Yu, Ching-Hua Hsieh, Hsiu-Jen Lin, Wei-Yu Chen, Chih-Chiang Tsao +1 more | 2024-07-30 |
| 11996400 | Manufacturing method of package on package structure | Hsuan-Ting Kuo, Ching-Hua Hsieh, Hsiu-Jen Lin, Hao-Jan Pei, Yu-Peng Tsai +3 more | 2024-05-28 |
| 11901258 | Iintegrated fan-out packages with embedded heat dissipation structure | Hao-Jan Pei, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Chia-Lun Chang +4 more | 2024-02-13 |
| 11874513 | Package structure | Chia-Lun Chang, Ching-Hua Hsieh, Hsiu-Jen Lin, Hsuan-Ting Kuo, Chia-Shen Cheng +1 more | 2024-01-16 |