Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176319 | Reflow method and system | Cheng-Shiuan Wong, Ching-Hua Hsieh, Hsiu-Jen Lin, Hao-Jan Pei, Wei-Yu Chen +2 more | 2024-12-24 |
| 12107064 | Semiconductor package and manufacturing method thereof | Jen-Jui Yu, Chih-Chiang Tsao, Mao-Yen Chang, Hsiu-Jen Lin, Ching-Hua Hsieh +1 more | 2024-10-01 |
| 12009345 | 3D package structure and methods of forming same | Meng-Tse Chen, Chung-Shi Liu, Chih-Wei Lin, Hui-Min Huang, Ming-Da Cheng | 2024-06-11 |
| 11996400 | Manufacturing method of package on package structure | Ching-Hua Hsieh, Cheng-Ting Chen, Hsiu-Jen Lin, Hao-Jan Pei, Yu-Peng Tsai +3 more | 2024-05-28 |
| 11874513 | Package structure | Chia-Lun Chang, Ching-Hua Hsieh, Cheng-Ting Chen, Hsiu-Jen Lin, Chia-Shen Cheng +1 more | 2024-01-16 |