Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176319 | Reflow method and system | Ching-Hua Hsieh, Hsiu-Jen Lin, Hao-Jan Pei, Hsuan-Ting Kuo, Wei-Yu Chen +2 more | 2024-12-24 |
| 11942451 | Semiconductor structure and method of forming the same | Mao-Yen Chang, Yu-Chia Lai, Ting Hao Kuo, Ching-Hua Hsieh, Hao-Yi Tsai +2 more | 2024-03-26 |
| 11862577 | Package structure and method of fabricating the same | Hao-Jan Pei, Ching-Hua Hsieh, Hsiu-Jen Lin, Wei-Yu Chen, Chia-Shen Cheng +2 more | 2024-01-02 |