Issued Patents 2024
Showing 1–25 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176282 | Manufacturing method of semiconductor package | Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Cheng-Chieh Hsieh, Hung-Yi Kuo +7 more | 2024-12-24 |
| 12166015 | Semiconductor package and manufacturing method of semiconductor package | Wei-Kang Hsieh, Hung-Yi Kuo, Kuo Lung Pan, Ting Hao Kuo, Yu-Chia Lai +3 more | 2024-12-10 |
| 12164158 | Package having prism structure and manufacturing method thereof | Che-Hsiang Hsu, Chen-Hua Yu, Chung-Shi Liu, Cheng-Chieh Hsieh, Hung-Yi Kuo +3 more | 2024-12-10 |
| 12159839 | Semiconductor packages | Tzu-Sung Huang, Hsiu-Jen Lin, Ming Hung Tseng, Tsung-Hsien Chiang, Tin-Hao Kuo +1 more | 2024-12-03 |
| 12159851 | Package structure having hollow cylinders and method of fabricating the same | Chen-Hua Yu, Chung-Shi Liu, Tin-Hao Kuo | 2024-12-03 |
| 12142597 | Integrated fan-out package and the methods of manufacturing | Chen-Hua Yu, Kuo-Chung Yee, Tin-Hao Kuo | 2024-11-12 |
| 12132024 | Semiconductor package and method of manufacturing the same | Tzuan-Horng Liu, Cheng-Chieh Hsieh, Tsung-Yuan Yu | 2024-10-29 |
| 12125804 | Semiconductor package and manufacturing method thereof | Wei-Kang Hsieh, Tin-Hao Kuo, Shih-Wei Chen | 2024-10-22 |
| 12113022 | Semiconductor package and manufacturing method of semiconductor package | Ying-Cheng Tseng, Yu-Chih Huang, Chia-Hung Liu | 2024-10-08 |
| 12105323 | Semiconductor package | Chung-Ming Weng, Hua-Kuei Lin, Chen-Hua Yu, Chung-Shi Liu, Cheng-Chieh Hsieh +5 more | 2024-10-01 |
| 12100682 | Package structure with conductive patterns in a redistribution layer | Yu-Chia Lai, Chih-Horng Chang, Chih-Hsuan Tai | 2024-09-24 |
| 12080615 | Method of manufacturing an integrated fan-out package having fan-out redistribution layer (RDL) to accommodate electrical connectors | Chen-Hua Yu, Kuo-Chung Yee, Tin-Hao Kuo | 2024-09-03 |
| 12074143 | Integrated circuit package and method | Chen-Hua Yu, Chi-Hui Lai, Tin-Hao Kuo, Chung-Shi Liu | 2024-08-27 |
| 12068212 | Package structure with through via extending through redistribution layer and method of manufacturing the same | Chih-Hsuan Tai, Chih-Hua Chen, Yu-Chih Huang, Chia-Hung Liu, Ting-Ting Kuo | 2024-08-20 |
| 12057405 | Packages with thick RDLs and thin RDLs stacked alternatingly | Po-Yuan Teng, Kuo Lung Pan, Yu-Chia Lai, Tin-Hao Kuo, Chen-Hua Yu | 2024-08-06 |
| 12058101 | Package structure and method of forming the same | Chen-Hua Yu, Chih-Hua Chen, Yu-Feng Chen | 2024-08-06 |
| 12051666 | Package structure and manufacturing method of package structure thereof | Po-Yuan Teng, Kuo Lung Pan, Sen-Kuei Hsu, Tin-Hao Kuo, Yi-Yang Lei +2 more | 2024-07-30 |
| 12040283 | Method of fabricating semiconductor structure | Tzu-Sung Huang, Cheng-Chieh Hsieh, Hsiu-Jen Lin, Hui-Jung Tsai, Hung-Yi Kuo +4 more | 2024-07-16 |
| 12027494 | Semiconductor device and manufacturing method thereof | Tzuan-Horng Liu, Chien Ling Hwang | 2024-07-02 |
| 12015017 | Package structure, package-on-package structure and method of fabricating the same | Chih-Hsuan Tai, Yu-Chih Huang, Chia-Hung Liu, Ting-Ting Kuo, Ban-Li Wu +2 more | 2024-06-18 |
| 12014976 | Chip package structure including a silicon substrate interposer and methods for forming the same | Kuo Lung Pan, Yu-Chia Lai, Teng-Yuan Lo, Mao-Yen Chang, Po-Yuan Teng +3 more | 2024-06-18 |
| 12014979 | Methods of forming semiconductor packages | Kuo Lung Pan, Shu-Rong Chun, Teng-Yuan Lo, Hung-Yi Kuo, Chih-Horng Chang +1 more | 2024-06-18 |
| 12009281 | Package structure and method of manufacturing the same | Shih-Wei Chen, Kuo Lung Pan, Tin-Hao Kuo, Po-Yuan Teng, Chi-Hui Lai | 2024-06-11 |
| 12009322 | Package structure with through-via in molding compound and dielectric layer | Chih-Hsuan Tai, Ting-Ting Kuo, Yu-Chih Huang, Chih-Wei Lin, Hsiu-Jen Lin +4 more | 2024-06-11 |
| 12002799 | Die stacking structure and method forming same | Chen-Hua Yu, Hung-Yi Kuo, Chung-Shi Liu, Cheng-Chieh Hsieh, Tsung-Yuan Yu +1 more | 2024-06-04 |