Issued Patents 2024
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142597 | Integrated fan-out package and the methods of manufacturing | Chen-Hua Yu, Hao-Yi Tsai, Tin-Hao Kuo | 2024-11-12 |
| 12080615 | Method of manufacturing an integrated fan-out package having fan-out redistribution layer (RDL) to accommodate electrical connectors | Chen-Hua Yu, Hao-Yi Tsai, Tin-Hao Kuo | 2024-09-03 |
| 12057406 | Package having redistribution layer structure with protective layer | Chen-Hua Yu, Chun-Hui Yu | 2024-08-06 |
| 12040566 | Antenna device | Chuei-Tang Wang, Chung-Hao Tsai, Jeng-Shien Hsieh, Wei-Heng Lin, Chen-Hua Yu | 2024-07-16 |
| 12033976 | Semiconductor package having a through intervia through the molding compound and fan-out redistribution layers disposed over the respective die of the stacked fan-out system-in-package | Chen-Hua Yu | 2024-07-09 |
| 12014993 | Package having redistribution layer structure with protective layer and method of fabricating the same | Chen-Hua Yu, Chun-Hui Yu | 2024-06-18 |
| 11978691 | Semiconductor device and manufacturing method thereof | Chen-Hua Yu | 2024-05-07 |
| 11961789 | Semiconductor package and manufacturing method thereof | Chen-Hua Yu, Chun-Hui Yu | 2024-04-16 |
| 11935760 | Package structure having thermal dissipation structure therein and manufacturing method thereof | Chen-Hua Yu, Yian-Liang Kuo | 2024-03-19 |
| 11929345 | Semiconductor device including binding agent adhering an integrated circuit device to an interposer | Chen-Hua Yu, Chun-Hui Yu | 2024-03-12 |
| 11916028 | Package structure and method of forming the same | Chen-Hua Yu, Chun-Hui Yu | 2024-02-27 |