Issued Patents 2024
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12174415 | Semiconductor package and manufacturing method thereof | Chih-Chieh Chang, Chung-Hao Tsai, Chen-Hua Yu | 2024-12-24 |
| 12165952 | Interposer directly bonded to bonding pads on a plurality of dies | Wen-Shiang Liao, Chieh-Yen Chen | 2024-12-10 |
| 12136593 | Electronic apparatus including antennas and directors | Tzu-Chun Tang, Chung-Hao Tsai, Chen-Hua Yu, Che-Wei Hsu | 2024-11-05 |
| 12125824 | Semiconductor stack structure and manufacturing method thereof | Chien-Yuan Huang, Shih-Chang Ku | 2024-10-22 |
| 12125812 | Integrated circuit packages and methods of forming the same | Chien-Yuan Huang, Shih-Chang Ku, Chen-Hua Yu | 2024-10-22 |
| 12125798 | Semiconductor package and method | Chen-Hua Yu, Jeng-Shien Hsieh, Chieh-Yen Chen | 2024-10-22 |
| 12100698 | Semiconductor device and manufacturing method thereof | Chih-Chieh Chang, Chung-Hao Tsai, Chen-Hua Yu | 2024-09-24 |
| 12094860 | Package structure and manufacturing method thereof | Chung-Hao Tsai, Chen-Hua Yu, Tzu-Chun Tang | 2024-09-17 |
| 12087757 | Integrated circuit packages | Chen-Hua Yu, Chung-Hao Tsai | 2024-09-10 |
| 12080684 | Die stacks and methods forming same | Chen-Hua Yu, Chung-Hao Tsai | 2024-09-03 |
| 12068295 | Deep partition power delivery with deep trench capacitor | Chen-Hua Yu, Chung-Hao Tsai, Chieh-Yen Chen | 2024-08-20 |
| 12057407 | Semiconductor package and method | Chen-Hua Yu, Jeng-Shien Hsieh, Chieh-Yen Chen | 2024-08-06 |
| 12051649 | Architecture for computing system package | Chen-Hua Yu, Chieh-Yen Chen, Chung-Hao Tsai | 2024-07-30 |
| 12046480 | Manufacturing method of a semiconductor device | Shou-Zen Chang, Chun-Lin Lu, Kai-Chiang Wu, Ching-Feng Yang, Vincent Chen +3 more | 2024-07-23 |
| 12040566 | Antenna device | Chung-Hao Tsai, Jeng-Shien Hsieh, Wei-Heng Lin, Kuo-Chung Yee, Chen-Hua Yu | 2024-07-16 |
| 12040281 | Semiconductor package structure comprising rigid-flexible substrate and manufacturing method thereof | Chen-Hua Yu, Chung-Shi Liu, Chih-Yuan Chang, Jiun Yi Wu, Jeng-Shien Hsieh +1 more | 2024-07-16 |
| 12033963 | Package structure comprising thermally conductive layer around the IC die | Chung-Hao Tsai, Tzu-Chun Tang, Chen-Hua Yu | 2024-07-09 |
| 12021047 | Semiconductor packages having a die, an encapsulant, and a redistribution structure | Chung-Hao Tsai, Chia-Chia Lin, Kai-Chiang Wu, Chen-Hua Yu | 2024-06-25 |
| 11984668 | Method of embedding low-k materials in antennas | Monsen Liu, Lai Wei Chih, Chung-Hao Tsai, Jeng-Shien Hsieh, En-Hsiang Yeh | 2024-05-14 |
| 11948926 | Integrated circuit package and method | Chen-Hua Yu, Wei Ling Chang, Chieh-Yen Chen | 2024-04-02 |
| 11929333 | Integrated fan-out package | Tzu-Chun Tang, Chieh-Yen Chen, Che-Wei Hsu | 2024-03-12 |
| 11923315 | Semiconductor package and manufacturing method thereof | Chung-Hao Tsai, Chen-Hua Yu, Wei-Ting Chen, Chien-Hsun Chen, Shih-Ya Huang | 2024-03-05 |
| 11908787 | Package structure and method of manufacturing the same | Chun-Lin Lu, Kai-Chiang Wu | 2024-02-20 |