Issued Patents 2024
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165952 | Interposer directly bonded to bonding pads on a plurality of dies | Wen-Shiang Liao, Chuei-Tang Wang | 2024-12-10 |
| 12125798 | Semiconductor package and method | Chen-Hua Yu, Jeng-Shien Hsieh, Chuei-Tang Wang | 2024-10-22 |
| 12068295 | Deep partition power delivery with deep trench capacitor | Chen-Hua Yu, Chung-Hao Tsai, Chuei-Tang Wang | 2024-08-20 |
| 12057407 | Semiconductor package and method | Chen-Hua Yu, Jeng-Shien Hsieh, Chuei-Tang Wang | 2024-08-06 |
| 12051649 | Architecture for computing system package | Chen-Hua Yu, Chuei-Tang Wang, Chung-Hao Tsai | 2024-07-30 |
| 11948926 | Integrated circuit package and method | Chen-Hua Yu, Wei Ling Chang, Chuei-Tang Wang | 2024-04-02 |
| 11929333 | Integrated fan-out package | Chuei-Tang Wang, Tzu-Chun Tang, Che-Wei Hsu | 2024-03-12 |