WL

Wen-Shiang Liao

TSMC: 18 patents #144 of 4,162Top 4%
📍 Wayaoxia, TW: #1 of 3 inventorsTop 35%
Overall (2024): #2,844 of 561,600Top 1%
18
Patents 2024

Issued Patents 2024

Showing 1–18 of 18 patents

Patent #TitleCo-InventorsDate
12170241 Embedded metal insulator metal structure Feng-Wei Kuo 2024-12-17
12165952 Interposer directly bonded to bonding pads on a plurality of dies Chieh-Yen Chen, Chuei-Tang Wang 2024-12-10
12164152 Method of fabricating semiconductor structure Feng-Wei Kuo 2024-12-10
12154846 3DIC package with interposer formed by spin on process 2024-11-26
12132074 Package Chih-Hang Tung 2024-10-29
12074125 Coaxial through via with novel high isolation cross coupling method for 3D integrated circuits Feng-Wei Kuo, Chewn-Pu Jou, Huan-Neng Chen, Lan-Chou Cho, William Wu Shen 2024-08-27
12066662 Apparatus for optical coupling and system for communication Feng-Wei Kuo, Robert Bogdan Staszewski, Jianglin Du 2024-08-20
12066658 Integrated optical devices and methods of forming the same Feng-Wei Kuo 2024-08-20
12062629 Multiband QAM interface for slab waveguide Huan-Neng Chen, Chewn-Pu Jou, Feng-Wei Kuo, Lan-Chou Cho, Yanghyo Kim 2024-08-13
12046544 Semiconductor package device with integrated inductor and manufacturing method thereof Ying-Chih Hsu 2024-07-23
12027478 Manufacturing method of semiconductor structure Feng-Wei Kuo 2024-07-02
12002770 Power management semiconductor package and manufacturing method thereof Ying-Chih Hsu 2024-06-04
11978697 Package structure 2024-05-07
11961809 Antenna apparatus and method Feng-Wei Kuo 2024-04-16
11953723 Thermally tunable waveguide and photonic integrated circuit component having the same Feng-Wei Kuo 2024-04-09
11953730 Method of fabricating semiconductor structure Feng-Wei Kuo 2024-04-09
11928413 Apparatus and method for generating a parameterized waveguide optical elements Feng-Wei Kuo 2024-03-12
11908788 3D IC decoupling capacitor structure and method for manufacturing the same Chewn-Pu Jou 2024-02-20