Issued Patents 2024
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12132074 | Package | Wen-Shiang Liao | 2024-10-29 |
| 12125794 | Semiconductor device and manufacturing method of semiconductor device | Chen-Hua Yu, Tung-Liang Shao, Su-Chun Yang, Wen-Lin Shih | 2024-10-22 |
| 12027446 | Method for forming a semiconductor component with a cooling structure | Tung-Liang Shao, Lawrence Chiang Sheu, Chen-Hua Yu, Yi-Li Hsiao | 2024-07-02 |
| 12002761 | Semiconductor device, stacked semiconductor device and manufacturing method of semiconductor device | Chen-Hua Yu, Tung-Liang Shao, Su-Chun Yang, Wen-Lin Shih | 2024-06-04 |
| 11996383 | Bonded semiconductor devices and methods of forming the same | Chen-Hua Yu, Tung-Liang Shao | 2024-05-28 |
| 11996351 | Packaged semiconductor device including liquid-cooled lid and methods of forming the same | Sheng-Tsung Hsiao, Jen-Yu Wang, Chung-Jung Wu, Tung-Liang Shao | 2024-05-28 |
| 11955405 | Semiconductor package including thermal interface structures and methods of forming the same | Jen-Yu Wang, Chung-Jung Wu, Sheng-Tsung Hsiao, Tung-Liang Shao, Chen-Hua Yu | 2024-04-09 |
| 11955378 | Bonding method of package components and bonding apparatus | Yi-Li Hsiao, Chen-Hua Yu, Tung-Liang Shao, Su-Chun Yang | 2024-04-09 |
| 11901263 | Semiconductor device and manufacturing method thereof | Chung-Jung Wu, Tung-Liang Shao, Sheng-Tsung Hsiao, Jen-Yu Wang | 2024-02-13 |