Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12027446 | Method for forming a semiconductor component with a cooling structure | Tung-Liang Shao, Chih-Hang Tung, Chen-Hua Yu, Yi-Li Hsiao | 2024-07-02 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12027446 | Method for forming a semiconductor component with a cooling structure | Tung-Liang Shao, Chih-Hang Tung, Chen-Hua Yu, Yi-Li Hsiao | 2024-07-02 |