Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12027446 | Method for forming a semiconductor component with a cooling structure | Tung-Liang Shao, Lawrence Chiang Sheu, Chih-Hang Tung, Chen-Hua Yu | 2024-07-02 |
| 11955378 | Bonding method of package components and bonding apparatus | Chih-Hang Tung, Chen-Hua Yu, Tung-Liang Shao, Su-Chun Yang | 2024-04-09 |