Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125794 | Semiconductor device and manufacturing method of semiconductor device | Chih-Hang Tung, Chen-Hua Yu, Tung-Liang Shao, Wen-Lin Shih | 2024-10-22 |
| 12002761 | Semiconductor device, stacked semiconductor device and manufacturing method of semiconductor device | Chih-Hang Tung, Chen-Hua Yu, Tung-Liang Shao, Wen-Lin Shih | 2024-06-04 |
| 11955378 | Bonding method of package components and bonding apparatus | Yi-Li Hsiao, Chih-Hang Tung, Chen-Hua Yu, Tung-Liang Shao | 2024-04-09 |