Issued Patents 2024
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125794 | Semiconductor device and manufacturing method of semiconductor device | Chih-Hang Tung, Chen-Hua Yu, Su-Chun Yang, Wen-Lin Shih | 2024-10-22 |
| 12027446 | Method for forming a semiconductor component with a cooling structure | Lawrence Chiang Sheu, Chih-Hang Tung, Chen-Hua Yu, Yi-Li Hsiao | 2024-07-02 |
| 12002761 | Semiconductor device, stacked semiconductor device and manufacturing method of semiconductor device | Chih-Hang Tung, Chen-Hua Yu, Su-Chun Yang, Wen-Lin Shih | 2024-06-04 |
| 11996383 | Bonded semiconductor devices and methods of forming the same | Chen-Hua Yu, Chih-Hang Tung | 2024-05-28 |
| 11996351 | Packaged semiconductor device including liquid-cooled lid and methods of forming the same | Sheng-Tsung Hsiao, Jen-Yu Wang, Chung-Jung Wu, Chih-Hang Tung | 2024-05-28 |
| 11955405 | Semiconductor package including thermal interface structures and methods of forming the same | Jen-Yu Wang, Chung-Jung Wu, Sheng-Tsung Hsiao, Chih-Hang Tung, Chen-Hua Yu | 2024-04-09 |
| 11955378 | Bonding method of package components and bonding apparatus | Yi-Li Hsiao, Chih-Hang Tung, Chen-Hua Yu, Su-Chun Yang | 2024-04-09 |
| 11901263 | Semiconductor device and manufacturing method thereof | Chung-Jung Wu, Chih-Hang Tung, Sheng-Tsung Hsiao, Jen-Yu Wang | 2024-02-13 |