Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11996351 | Packaged semiconductor device including liquid-cooled lid and methods of forming the same | Jen-Yu Wang, Chung-Jung Wu, Tung-Liang Shao, Chih-Hang Tung | 2024-05-28 |
| 11955405 | Semiconductor package including thermal interface structures and methods of forming the same | Jen-Yu Wang, Chung-Jung Wu, Tung-Liang Shao, Chih-Hang Tung, Chen-Hua Yu | 2024-04-09 |
| 11901263 | Semiconductor device and manufacturing method thereof | Chung-Jung Wu, Chih-Hang Tung, Tung-Liang Shao, Jen-Yu Wang | 2024-02-13 |