Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12136593 | Electronic apparatus including antennas and directors | Chung-Hao Tsai, Chen-Hua Yu, Chuei-Tang Wang, Che-Wei Hsu | 2024-11-05 |
| 12094860 | Package structure and manufacturing method thereof | Chuei-Tang Wang, Chung-Hao Tsai, Chen-Hua Yu | 2024-09-17 |
| 12033963 | Package structure comprising thermally conductive layer around the IC die | Chung-Hao Tsai, Chuei-Tang Wang, Chen-Hua Yu | 2024-07-09 |
| 11929333 | Integrated fan-out package | Chuei-Tang Wang, Chieh-Yen Chen, Che-Wei Hsu | 2024-03-12 |