Issued Patents 2024
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12174415 | Semiconductor package and manufacturing method thereof | Chih-Chieh Chang, Chen-Hua Yu, Chuei-Tang Wang | 2024-12-24 |
| 12136593 | Electronic apparatus including antennas and directors | Tzu-Chun Tang, Chen-Hua Yu, Chuei-Tang Wang, Che-Wei Hsu | 2024-11-05 |
| 12100698 | Semiconductor device and manufacturing method thereof | Chih-Chieh Chang, Chen-Hua Yu, Chuei-Tang Wang | 2024-09-24 |
| 12094860 | Package structure and manufacturing method thereof | Chuei-Tang Wang, Chen-Hua Yu, Tzu-Chun Tang | 2024-09-17 |
| 12087757 | Integrated circuit packages | Chen-Hua Yu, Chuei-Tang Wang | 2024-09-10 |
| 12080684 | Die stacks and methods forming same | Chen-Hua Yu, Chuei-Tang Wang | 2024-09-03 |
| 12068295 | Deep partition power delivery with deep trench capacitor | Chen-Hua Yu, Chuei-Tang Wang, Chieh-Yen Chen | 2024-08-20 |
| 12051649 | Architecture for computing system package | Chen-Hua Yu, Chieh-Yen Chen, Chuei-Tang Wang | 2024-07-30 |
| 12040566 | Antenna device | Chuei-Tang Wang, Jeng-Shien Hsieh, Wei-Heng Lin, Kuo-Chung Yee, Chen-Hua Yu | 2024-07-16 |
| 12033963 | Package structure comprising thermally conductive layer around the IC die | Tzu-Chun Tang, Chuei-Tang Wang, Chen-Hua Yu | 2024-07-09 |
| 12021047 | Semiconductor packages having a die, an encapsulant, and a redistribution structure | Chia-Chia Lin, Kai-Chiang Wu, Chuei-Tang Wang, Chen-Hua Yu | 2024-06-25 |
| 11984668 | Method of embedding low-k materials in antennas | Monsen Liu, Lai Wei Chih, Jeng-Shien Hsieh, En-Hsiang Yeh, Chuei-Tang Wang | 2024-05-14 |
| 11923315 | Semiconductor package and manufacturing method thereof | Chen-Hua Yu, Chuei-Tang Wang, Wei-Ting Chen, Chien-Hsun Chen, Shih-Ya Huang | 2024-03-05 |