Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12021047 | Semiconductor packages having a die, an encapsulant, and a redistribution structure | Chung-Hao Tsai, Kai-Chiang Wu, Chuei-Tang Wang, Chen-Hua Yu | 2024-06-25 |
CL
Chia-Chia Lin
Overall (2024): #509,846 of 561,600Top 95%
1
Patents 2024