Issued Patents 2024
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12132247 | Semiconductor package and manufacturing method thereof | Yen-Ping Wang, Han-Ping Pu, Kai-Chiang Wu, Chung-Yi Hsu | 2024-10-29 |
| 12119303 | Package structure with reinforcement structures in a redistribution circuit structure and manufacturing method thereof | Chen-Hua Yu, Han-Ping Pu, Kai-Chiang Wu | 2024-10-15 |
| 12057358 | Package structure with antenna pattern | Sheng-Ta Lin, Kai-Chiang Wu | 2024-08-06 |
| 12046480 | Manufacturing method of a semiconductor device | Shou-Zen Chang, Kai-Chiang Wu, Ching-Feng Yang, Vincent Chen, Chuei-Tang Wang +3 more | 2024-07-23 |
| 11967558 | Wafer stacking structure and manufacturing method thereof | Shou-Zen Chang, Jium Ming Lin | 2024-04-23 |
| 11908787 | Package structure and method of manufacturing the same | Chuei-Tang Wang, Kai-Chiang Wu | 2024-02-20 |
| 11894330 | Methods of manufacturing a semiconductor device including a joint adjacent to a post | Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang, Shih-Wei Liang, Ching-Feng Yang +2 more | 2024-02-06 |