Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12062635 | Semiconductor device packages including conductors electrically connecting stacked semiconductor devices by extending along surfaces of the semiconductor devices | Po Chih Yang, Yu-Jen Chen, Po Chen Kuo | 2024-08-13 |
| 11894330 | Methods of manufacturing a semiconductor device including a joint adjacent to a post | Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang, Ching-Feng Yang +2 more | 2024-02-06 |