Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125816 | Semiconductor device assemblies and systems with one or more dies at least partially embedded in a redistribution layer (RDL) and methods for making the same | Jong Sik Paek | 2024-10-22 |
| 12062635 | Semiconductor device packages including conductors electrically connecting stacked semiconductor devices by extending along surfaces of the semiconductor devices | Yu-Jen Chen, Po Chen Kuo, Shih-Wei Liang | 2024-08-13 |
| 12046513 | Die corner protection by using polymer deposition technology | — | 2024-07-23 |