Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125816 | Semiconductor device assemblies and systems with one or more dies at least partially embedded in a redistribution layer (RDL) and methods for making the same | Po Chih Yang | 2024-10-22 |
| 12051684 | Face-to-face semiconductor device with fan-out porch | Yeongbeom Ko | 2024-07-30 |
| 11961742 | Semiconductor device and manufacturing method thereof | Doo Hyun Park, Seong Min Seo, Sung Geun Kang, Yong Seon Song, Wang Gu Lee +3 more | 2024-04-16 |
| 11942430 | Stacked die modules for semiconductor device assemblies and methods of manufacturing stacked die modules | — | 2024-03-26 |
| 11942455 | Stacked semiconductor dies for semiconductor device assemblies | Yeongbeom Ko, Youngik Kwon, Jungbae Lee | 2024-03-26 |
| 11935856 | Semiconductor device having a redistribution layer | Doo Hyun Park | 2024-03-19 |