Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11942455 | Stacked semiconductor dies for semiconductor device assemblies | Yeongbeom Ko, Youngik Kwon, Jong Sik Paek | 2024-03-26 |
| 11923332 | Semiconductor die with capillary flow structures for direct chip attachment | — | 2024-03-05 |
| 11887938 | Semiconductor device assemblies with conductive underfill dams for grounding EMI shields and methods for making the same | — | 2024-01-30 |