Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12132247 | Semiconductor package and manufacturing method thereof | Chun-Lin Lu, Han-Ping Pu, Kai-Chiang Wu, Chung-Yi Hsu | 2024-10-29 |
| 12080563 | Semiconductor devices and methods of manufacturing | Chien-Hsun Chen, Yu-Min Liang, Jiun Yi Wu, Chen-Hua Yu, Kai-Chiang Wu | 2024-09-03 |
| 12062619 | Semiconductor packages and forming methods thereof | Kai-Chiang Wu, Chin-Liang Chen, Jiun Yi Wu | 2024-08-13 |
| 12046480 | Manufacturing method of a semiconductor device | Shou-Zen Chang, Chun-Lin Lu, Kai-Chiang Wu, Ching-Feng Yang, Vincent Chen +3 more | 2024-07-23 |
| 11894330 | Methods of manufacturing a semiconductor device including a joint adjacent to a post | Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Shih-Wei Liang, Ching-Feng Yang +2 more | 2024-02-06 |