Issued Patents 2024
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165946 | Semiconductor package and manufacturing method thereof | Chi-Yang Yu, Chin-Liang Chen, Kuan-Lin Ho, Wen-Lin Chen | 2024-12-10 |
| 12142560 | Semiconductor packages and methods of forming same | Chung-Shi Liu, Chien-Hsun Lee, Jiun Yi Wu, Hao-Cheng Hou, Hung-Jen Lin +3 more | 2024-11-12 |
| 12080563 | Semiconductor devices and methods of manufacturing | Chien-Hsun Chen, Yen-Ping Wang, Jiun Yi Wu, Chen-Hua Yu, Kai-Chiang Wu | 2024-09-03 |
| 12062604 | Semiconductor structure and manufacturing method thereof | Kuan-Lin Ho, Chin-Liang Chen, Jiun Yi Wu, Chi-Yang Yu, Wei-Yu Chen | 2024-08-13 |
| 11908835 | Semiconductor structure and manufacturing method thereof | Chi-Yang Yu, Kuan-Lin Ho, Chin-Liang Chen | 2024-02-20 |
| 11894312 | Semiconductor packages and method of manufacture | Wei-Yu Chen, Chun-Chih Chuang, Kuan-Lin Ho, Jiun Yi Wu | 2024-02-06 |
| 11894332 | Substrate and package structure | Wei-Hung Lin, Hsiu-Jen Lin, Ming-Da Cheng, Chen-Shien Chen, Chung-Shi Liu | 2024-02-06 |