Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165946 | Semiconductor package and manufacturing method thereof | Chi-Yang Yu, Chin-Liang Chen, Kuan-Lin Ho, Yu-Min Liang | 2024-12-10 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165946 | Semiconductor package and manufacturing method thereof | Chi-Yang Yu, Chin-Liang Chen, Kuan-Lin Ho, Yu-Min Liang | 2024-12-10 |