Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165946 | Semiconductor package and manufacturing method thereof | Chi-Yang Yu, Kuan-Lin Ho, Yu-Min Liang, Wen-Lin Chen | 2024-12-10 |
| 12062604 | Semiconductor structure and manufacturing method thereof | Kuan-Lin Ho, Jiun Yi Wu, Chi-Yang Yu, Yu-Min Liang, Wei-Yu Chen | 2024-08-13 |
| 12062619 | Semiconductor packages and forming methods thereof | Kai-Chiang Wu, Jiun Yi Wu, Yen-Ping Wang | 2024-08-13 |
| 11972956 | Lid attach process and dispenser head | Wei-Ting Lin, Yu-Chih Liu, Kuan-Lin Ho, Jason Shen | 2024-04-30 |
| 11908835 | Semiconductor structure and manufacturing method thereof | Chi-Yang Yu, Kuan-Lin Ho, Yu-Min Liang | 2024-02-20 |