Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165946 | Semiconductor package and manufacturing method thereof | Chi-Yang Yu, Chin-Liang Chen, Yu-Min Liang, Wen-Lin Chen | 2024-12-10 |
| 12062604 | Semiconductor structure and manufacturing method thereof | Chin-Liang Chen, Jiun Yi Wu, Chi-Yang Yu, Yu-Min Liang, Wei-Yu Chen | 2024-08-13 |
| 11972956 | Lid attach process and dispenser head | Chin-Liang Chen, Wei-Ting Lin, Yu-Chih Liu, Jason Shen | 2024-04-30 |
| 11908835 | Semiconductor structure and manufacturing method thereof | Chi-Yang Yu, Chin-Liang Chen, Yu-Min Liang | 2024-02-20 |
| 11894312 | Semiconductor packages and method of manufacture | Wei-Yu Chen, Chun-Chih Chuang, Yu-Min Liang, Jiun Yi Wu | 2024-02-06 |