Issued Patents 2024
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12174758 | Computer system having multiple nodes with flexible configurable architecture | Han-Chuan Tsai, Yen-Ping Tung, Sz-Chin Shih | 2024-12-24 |
| 12148486 | Read voltage adjustment method, memory storage device and memory control circuit unit | Hsiao-Yi Lin, Shih-Jia Zeng, Chen Yang Tang, Shi-Chieh Hsu | 2024-11-19 |
| 12146646 | Light-emitting sphere | — | 2024-11-19 |
| 12124743 | Data reading method, memory storage device, and memory control circuit unit | Yu-Heng Liu, Yu-Siang Yang, An-Cheng Liu | 2024-10-22 |
| 12119229 | Method of manufacturing semiconductor structure | Yu-Hsiang Hu, Wei-Yu Chen, Hung-Jui Kuo, Ming-Da Cheng, Chung-Shi Liu | 2024-10-15 |
| 12119238 | Semiconductor bonding structures and methods | Meng-Tse Chen, Hsiu-Jen Lin, Kuei-Wei Huang, Ming-Da Cheng, Chung-Shi Liu | 2024-10-15 |
| 12094792 | Package structure having lid with protrusion and manufacturing method thereof | Kuan-Min Wang, Chang-Jung Hsueh, Jui-Chang Chuang, Kuo-Chin Chang | 2024-09-17 |
| 12068303 | Package structure | Hui-Min Huang, Chang-Jung Hsueh, Wan-Yu Chiang, Ming-Da Cheng, Mirng-Ji Lii | 2024-08-20 |
| 12051632 | Semiconductor package structure and method for forming semiconductor package structure | Po-Hao Tsai, Ming-Da Cheng, Mirng-Ji Lii | 2024-07-30 |
| 12027435 | Packages including multiple encapsulated substrate blocks and overlapping redistribution structures | Chen-Shien Chen, Kuo-Ching Hsu, Hui-Min Huang, Ming-Da Cheng, Mirng-Ji Lii | 2024-07-02 |
| 12021037 | Method for manufacturing package structure | Yi-Da Tsai, Cheng Ping Lin, Chih-Wei Lin, Ming-Da Cheng, Ching-Hua Hsieh +1 more | 2024-06-25 |
| 12015002 | Chip structure and method for forming the same | Hui-Min Huang, Ming-Da Cheng, Chang-Jung Hsueh, Kai Jun Zhan, Yung-Sheng Lin | 2024-06-18 |
| 12008262 | Read voltage control method, memory storage device and memory control circuit unit | Shih-Jia Zeng, Chun Tsao, Chih-Wei Wang | 2024-06-11 |
| 12001560 | Method and system for avoiding boot failure from platform firmware resilience execution | Tzu-Heng Wen, Yen-Ping Tung | 2024-06-04 |
| 11990440 | Structure and formation method of semiconductor device with conductive bumps | Hui-Min Huang, Ming-Da Cheng, Chang-Jung Hsueh, Kai Jun Zhan, Yung-Sheng Lin | 2024-05-21 |
| 11972139 | Read voltage level correction method, memory storage device, and memory control circuit unit | Shih-Jia Zeng, Chun Tsao, Hsiao-Yi Lin | 2024-04-30 |
| 11961817 | Apparatus and method for forming a package structure | Kai Jun Zhan, Chang-Jung Hsueh, Hui-Min Huang, Ming-Da Cheng | 2024-04-16 |
| 11962328 | Decoding method, memory storage device and memory control circuit unit | Shih-Jia Zeng, Yi Fang Chang, Chun Tsao, Chen-An Hsu | 2024-04-16 |
| 11955460 | Advanced info POP and method of forming thereof | Yi-Da Tsai, Meng-Tse Chen, Sheng-Feng Weng, Sheng-Hsiang Chiu, Ming-Da Cheng +2 more | 2024-04-09 |
| 11901256 | Semiconductor device, semiconductor package, and methods of manufacturing the same | Chang-Jung Hsueh, Cheng-Nan Lin, Wan-Yu Chiang, Ching-Wen Hsiao, Ming-Da Cheng | 2024-02-13 |
| 11894332 | Substrate and package structure | Hsiu-Jen Lin, Ming-Da Cheng, Yu-Min Liang, Chen-Shien Chen, Chung-Shi Liu | 2024-02-06 |
| 11887955 | Semiconductor die including stress-resistant bonding structures and methods of forming the same | Hui-Min Huang, Ming-Da Cheng, Chang-Jung Hsueh, Kai Jun Zhan, Wan-Yu Chiang | 2024-01-30 |