Issued Patents 2024
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12094792 | Package structure having lid with protrusion and manufacturing method thereof | Kuan-Min Wang, Jui-Chang Chuang, Wei-Hung Lin, Kuo-Chin Chang | 2024-09-17 |
| 12068303 | Package structure | Wei-Hung Lin, Hui-Min Huang, Wan-Yu Chiang, Ming-Da Cheng, Mirng-Ji Lii | 2024-08-20 |
| 12015002 | Chip structure and method for forming the same | Hui-Min Huang, Ming-Da Cheng, Wei-Hung Lin, Kai Jun Zhan, Yung-Sheng Lin | 2024-06-18 |
| 11990440 | Structure and formation method of semiconductor device with conductive bumps | Hui-Min Huang, Ming-Da Cheng, Wei-Hung Lin, Kai Jun Zhan, Yung-Sheng Lin | 2024-05-21 |
| 11961944 | Semiconductor device and manufacturing method thereof | Chen-En Yen, Ming-Da Cheng, Mirng-Ji Lii, Wen-Hsiung Lu, Cheng-Jen Lin +1 more | 2024-04-16 |
| 11961817 | Apparatus and method for forming a package structure | Kai Jun Zhan, Hui-Min Huang, Wei-Hung Lin, Ming-Da Cheng | 2024-04-16 |
| 11901256 | Semiconductor device, semiconductor package, and methods of manufacturing the same | Cheng-Nan Lin, Wan-Yu Chiang, Wei-Hung Lin, Ching-Wen Hsiao, Ming-Da Cheng | 2024-02-13 |
| 11887955 | Semiconductor die including stress-resistant bonding structures and methods of forming the same | Hui-Min Huang, Ming-Da Cheng, Wei-Hung Lin, Kai Jun Zhan, Wan-Yu Chiang | 2024-01-30 |