Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12094792 | Package structure having lid with protrusion and manufacturing method thereof | Kuan-Min Wang, Chang-Jung Hsueh, Jui-Chang Chuang, Wei-Hung Lin | 2024-09-17 |
| 12021048 | Semiconductor device | Chien-Hao Hsu, Yen-Kun Lai, Wei-Hsiang Tu, Hao-Chun Liu, Mirng-Ji Lii | 2024-06-25 |
| 12009327 | Semiconductor die | Yen-Kun Lai, Chien-Hao Hsu, Wei-Hsiang Tu, Mirng-Ji Lii | 2024-06-11 |