Issued Patents 2024
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12136644 | Process for tuning via profile in dielectric material | Chun-Kai Tzeng, Cheng-Jen Lin, Yung-Ching Chao, Ming-Da Cheng | 2024-11-05 |
| 12087648 | Seal ring structure with zigzag patterns and method forming same | Kuan-Hung Chen, Hong-Seng Shue, Po-Hao Tsai | 2024-09-10 |
| 12068303 | Package structure | Wei-Hung Lin, Hui-Min Huang, Chang-Jung Hsueh, Wan-Yu Chiang, Ming-Da Cheng | 2024-08-20 |
| 12062586 | Semiconductor device structure with magnetic element | Mill-Jer Wang, Tang-Jung Chiu, Chi-Chang Lai, Chia-Heng Tsai, Weil Liao | 2024-08-13 |
| 12051632 | Semiconductor package structure and method for forming semiconductor package structure | Po-Hao Tsai, Wei-Hung Lin, Ming-Da Cheng | 2024-07-30 |
| 12027435 | Packages including multiple encapsulated substrate blocks and overlapping redistribution structures | Chen-Shien Chen, Kuo-Ching Hsu, Wei-Hung Lin, Hui-Min Huang, Ming-Da Cheng | 2024-07-02 |
| 12021048 | Semiconductor device | Chien-Hao Hsu, Yen-Kun Lai, Wei-Hsiang Tu, Hao-Chun Liu, Kuo-Chin Chang | 2024-06-25 |
| 12009327 | Semiconductor die | Yen-Kun Lai, Chien-Hao Hsu, Wei-Hsiang Tu, Kuo-Chin Chang | 2024-06-11 |
| 11990428 | Bonding structures in semiconductor packaged device and method of forming same | Hao-Chun Liu, Ching-Wen Hsiao, Kuo-Ching Hsu | 2024-05-21 |
| 11967579 | Method for forming package structure with cavity substrate | Po-Hao Tsai, Ming-Da Cheng | 2024-04-23 |
| 11961944 | Semiconductor device and manufacturing method thereof | Chen-En Yen, Ming-Da Cheng, Wen-Hsiung Lu, Cheng-Jen Lin, Chin Wei Kang +1 more | 2024-04-16 |
| 11942445 | Semiconductor device with conductive pad | Chen-En Yen, Chin Wei Kang, Kai Jun Zhan, Wen-Hsiung Lu, Cheng-Jen Lin +1 more | 2024-03-26 |
| 11908818 | Semiconductor device | Sheng-Yu Wu, Ching-Hui Chen, Kai-Di Wu, Chien-Hung Kuo, Chao-Yi Wang +3 more | 2024-02-20 |
| 11901266 | Semiconductor device structure and method for forming the same | Ting-Li Yang, Wen-Hsiung Lu, Lung-Kai Mao, Fu Wei Liu | 2024-02-13 |
| 11894241 | Heterogeneous bonding structure and method forming same | Chen-Shien Chen, Lung-Kai Mao, Ming-Da Cheng, Wen-Hsiung Lu | 2024-02-06 |