Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12009256 | Redistribution lines with protection layers and method forming same | Ming-Da Cheng, Wen-Hsiung Lu, Yung-Han Chuang, Lung-Kai Mao, Yung-Sheng Lin | 2024-06-11 |
| 11961944 | Semiconductor device and manufacturing method thereof | Chen-En Yen, Ming-Da Cheng, Mirng-Ji Lii, Wen-Hsiung Lu, Cheng-Jen Lin +1 more | 2024-04-16 |
| 11942445 | Semiconductor device with conductive pad | Chen-En Yen, Kai Jun Zhan, Wen-Hsiung Lu, Cheng-Jen Lin, Ming-Da Cheng +1 more | 2024-03-26 |