Issued Patents 2024
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12141519 | Systems and methods for managing text settings based upon user distance with heterogeneous computing platforms | Hariprasad Janardana Iyer, Daniel L. Hamlin, Todd Erick Swierk, Srikanth Kondapi | 2024-11-12 |
| 12109669 | Pipe plier structure | Shih-Liang Huang | 2024-10-08 |
| 12064754 | Titanium catalyst and synthesizing polyester resins | Yi-Chou Tsai, John Di-Yi Ou, Chuan-Sheng Huang | 2024-08-20 |
| 12057670 | Semiconductor package structure and method for manufacturing the same | An-Hsuan HSU | 2024-08-06 |
| 12033870 | Bump structure and method of making the same | Wen-Hsiung Lu, Ming-Da Cheng, Su-Fei Lin, Hsu-Lun Liu, Chien-Pin Chan | 2024-07-09 |
| 12015002 | Chip structure and method for forming the same | Hui-Min Huang, Ming-Da Cheng, Wei-Hung Lin, Chang-Jung Hsueh, Kai Jun Zhan | 2024-06-18 |
| 12009256 | Redistribution lines with protection layers and method forming same | Ming-Da Cheng, Wen-Hsiung Lu, Chin Wei Kang, Yung-Han Chuang, Lung-Kai Mao | 2024-06-11 |
| 11994787 | Method and apparatus for closed-loop camera shutter control and remediation hardware | Geroncio O. Tan, Daniel L. Hamlin, Yao-Hsien Huang | 2024-05-28 |
| 11990440 | Structure and formation method of semiconductor device with conductive bumps | Hui-Min Huang, Ming-Da Cheng, Wei-Hung Lin, Chang-Jung Hsueh, Kai Jun Zhan | 2024-05-21 |