Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12113044 | Semiconductor package and manufacturing method thereof | Shan Wang, Chin-Li KAO | 2024-10-08 |
| 12057670 | Semiconductor package structure and method for manufacturing the same | Yung-Sheng Lin | 2024-08-06 |