Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12113044 | Semiconductor package and manufacturing method thereof | Chin-Li KAO, An-Hsuan HSU | 2024-10-08 |
| 12021169 | Composite substrate, method for manufacturing the same and method for manufacturing light-emitting device using the same | Yu-Piao Wang, Chiahao Tsai, Qin Wang, Bin Fang, Liangliang Gui +4 more | 2024-06-25 |