Issued Patents 2024
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12068303 | Package structure | Wei-Hung Lin, Chang-Jung Hsueh, Wan-Yu Chiang, Ming-Da Cheng, Mirng-Ji Lii | 2024-08-20 |
| 12027435 | Packages including multiple encapsulated substrate blocks and overlapping redistribution structures | Chen-Shien Chen, Kuo-Ching Hsu, Wei-Hung Lin, Ming-Da Cheng, Mirng-Ji Lii | 2024-07-02 |
| 12025892 | Electronic device with conductive lines having different widths | Chih-Hao Hsu, Chia-Min Yeh, Hsieh-Li Chou, Cheng-Tso Chen, Li-Wei Sung +1 more | 2024-07-02 |
| 12015002 | Chip structure and method for forming the same | Ming-Da Cheng, Wei-Hung Lin, Chang-Jung Hsueh, Kai Jun Zhan, Yung-Sheng Lin | 2024-06-18 |
| 12009345 | 3D package structure and methods of forming same | Meng-Tse Chen, Chung-Shi Liu, Chih-Wei Lin, Hsuan-Ting Kuo, Ming-Da Cheng | 2024-06-11 |
| 11990440 | Structure and formation method of semiconductor device with conductive bumps | Ming-Da Cheng, Wei-Hung Lin, Chang-Jung Hsueh, Kai Jun Zhan, Yung-Sheng Lin | 2024-05-21 |
| 11961817 | Apparatus and method for forming a package structure | Kai Jun Zhan, Chang-Jung Hsueh, Wei-Hung Lin, Ming-Da Cheng | 2024-04-16 |
| 11957717 | Anti-human MSLN antibody and MSLN-targeting immune effector cell | Fei Huang, Tao Peng, Xuemei Zou, Pinglei Liu, Dachun Liu | 2024-04-16 |
| 11957018 | Display device | Li-Wei Sung, Cheng-Tso Chen, Chia-Min Yeh | 2024-04-09 |
| 11901319 | Semiconductor package system and method | Chih-Wei Lin, Tsai-Tsung Tsai, Ming-Da Cheng, Chung-Shi Liu, Chen-Hua Yu | 2024-02-13 |
| 11887955 | Semiconductor die including stress-resistant bonding structures and methods of forming the same | Ming-Da Cheng, Chang-Jung Hsueh, Wei-Hung Lin, Kai Jun Zhan, Wan-Yu Chiang | 2024-01-30 |