Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12068303 | Package structure | Wei-Hung Lin, Hui-Min Huang, Chang-Jung Hsueh, Ming-Da Cheng, Mirng-Ji Lii | 2024-08-20 |
| 11901256 | Semiconductor device, semiconductor package, and methods of manufacturing the same | Chang-Jung Hsueh, Cheng-Nan Lin, Wei-Hung Lin, Ching-Wen Hsiao, Ming-Da Cheng | 2024-02-13 |
| 11887955 | Semiconductor die including stress-resistant bonding structures and methods of forming the same | Hui-Min Huang, Ming-Da Cheng, Chang-Jung Hsueh, Wei-Hung Lin, Kai Jun Zhan | 2024-01-30 |