Issued Patents 2024
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12015002 | Chip structure and method for forming the same | Hui-Min Huang, Ming-Da Cheng, Wei-Hung Lin, Chang-Jung Hsueh, Yung-Sheng Lin | 2024-06-18 |
| 11990440 | Structure and formation method of semiconductor device with conductive bumps | Hui-Min Huang, Ming-Da Cheng, Wei-Hung Lin, Chang-Jung Hsueh, Yung-Sheng Lin | 2024-05-21 |
| 11978720 | Semiconductor device package and methods of manufacture | Chin-Fu Kao, Kuang-Chun Lee, Ming-Da Cheng, Chen-Shien Chen | 2024-05-07 |
| 11961817 | Apparatus and method for forming a package structure | Chang-Jung Hsueh, Hui-Min Huang, Wei-Hung Lin, Ming-Da Cheng | 2024-04-16 |
| 11942445 | Semiconductor device with conductive pad | Chen-En Yen, Chin Wei Kang, Wen-Hsiung Lu, Cheng-Jen Lin, Ming-Da Cheng +1 more | 2024-03-26 |
| 11909368 | Dual mode notch filter | Chinmaya Mishra | 2024-02-20 |
| 11887955 | Semiconductor die including stress-resistant bonding structures and methods of forming the same | Hui-Min Huang, Ming-Da Cheng, Chang-Jung Hsueh, Wei-Hung Lin, Wan-Yu Chiang | 2024-01-30 |