Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12119276 | Package structure with protective lid | Wen-Yi Lin, Chien-Chen Li, Chen-Shien Chen | 2024-10-15 |
| 11978720 | Semiconductor device package and methods of manufacture | Kai Jun Zhan, Chin-Fu Kao, Ming-Da Cheng, Chen-Shien Chen | 2024-05-07 |