Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125715 | Chip package structure with nickel layer | Yu-Huan Chen, Chen-Shien Chen | 2024-10-22 |
| 12040266 | Package substrate, package using the same, and method of manufacturing the same | Hungen Hsu, Wei-Tien Shen | 2024-07-16 |
| 12027435 | Packages including multiple encapsulated substrate blocks and overlapping redistribution structures | Chen-Shien Chen, Wei-Hung Lin, Hui-Min Huang, Ming-Da Cheng, Mirng-Ji Lii | 2024-07-02 |
| 12002746 | Chip package structure with metal-containing layer | Yu-Huan Chen, Chen-Shien Chen | 2024-06-04 |
| 11990428 | Bonding structures in semiconductor packaged device and method of forming same | Hao-Chun Liu, Ching-Wen Hsiao, Mirng-Ji Lii | 2024-05-21 |