Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12040266 | Package substrate, package using the same, and method of manufacturing the same | Hungen Hsu, Kuo-Ching Hsu | 2024-07-16 |
WS
Wei-Tien Shen
Overall (2024): #223,904 of 561,600Top 40%
1
Patents 2024