Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12033870 | Bump structure and method of making the same | Wen-Hsiung Lu, Ming-Da Cheng, Hsu-Lun Liu, Chien-Pin Chan, Yung-Sheng Lin | 2024-07-09 |
SL
Su-Fei Lin
Overall (2024): #254,974 of 561,600Top 50%
1
Patents 2024