Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12033870 | Bump structure and method of making the same | Wen-Hsiung Lu, Ming-Da Cheng, Su-Fei Lin, Hsu-Lun Liu, Yung-Sheng Lin | 2024-07-09 |
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Chien-Pin Chan
Overall (2024): #515,672 of 561,600Top 95%
1
Patents 2024